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Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects.

Chaoqi ZhangParagkumar ThadesarMuneeb ZiaThomas E. SarveyMuhannad S. Bakir
Published in: 3DIC (2014)
Keyphrases
  • input output
  • fiber optic
  • lower cost
  • real time
  • data model
  • information integration
  • data sets
  • decision trees
  • case study
  • multi agent
  • lightweight
  • theorem prover
  • power dissipation