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Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance.
Ankit Kaul
Yandong Luo
Xiaochen Peng
Shimeng Yu
Muhannad S. Bakir
Published in:
3DIC (2021)
Keyphrases
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artificial intelligence
infrared
mobile devices
power plant
feed forward
reliability analysis
embedded systems
finite element analysis
reliability assessment
expert systems
mobile applications
learning rules
cognitive model
heat transfer
embedded devices
electronic devices