Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer.
Li ZhengMuhannad S. BakirPublished in: SoCC (2012)
Keyphrases
- cmos technology
- low voltage
- integrated circuit
- low power
- input output
- high speed
- transmission line
- printed circuit boards
- power dissipation
- power distribution
- power grid
- electrical properties
- power consumption
- low cost
- fiber optic
- dna computing
- electronic circuits
- physical characteristics
- lower cost
- electrical activity
- case study
- power transmission
- computer engineering
- image sensor
- parallel processing
- power system
- real time
- silicon dioxide