High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating.
Sreejith Kochupurackal RajanMing Jui LiMuhannad S. BakirGary S. MayPublished in: 3DIC (2019)
Keyphrases
- high density
- low density
- close proximity
- thin film
- high power
- data center
- electron microscopy
- room temperature
- magnetic recording
- high bandwidth
- image alignment
- magnetic tape
- field effect transistors
- dynamic time warping
- mechanical design
- data sets
- procrustes analysis
- sequence alignment
- multiple objects
- data streams
- genetic algorithm