A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration.
Rakshith SaligramAnkit KaulMuhannad S. BakirArijit RaychowdhuryPublished in: VLSI-SOC (2020)
Keyphrases
- high speed
- study proposes
- computational model
- statistical model
- high level
- prior knowledge
- artificial neural networks
- regression analysis
- management system
- real time
- theoretical framework
- mathematical model
- empirical studies
- network model
- prediction model
- neural network model
- simulation study
- probabilistic model
- wireless sensor networks
- cost function
- data sets