Login / Signup

3D chip stacking with C4 technology.

Bing DangSteven L. WrightPaul S. AndryEdmund J. SprogisCornelia K. TsangM. John InterranteBucknell C. WebbRobert J. PolastreRaymond R. HortonChirag S. PatelArun SharmaJ. ZhengKatsuyuki SakumaJohn U. Knickerbocker
Published in: IBM J. Res. Dev. (2008)
Keyphrases
  • high speed
  • case study
  • data sets
  • data processing
  • rapid development
  • key technologies
  • low cost
  • technological advances
  • e learning
  • personal computer
  • ensemble learning
  • physical design
  • cmos technology