John U. Knickerbocker

Publication Activity (10 Years)

Years Active: 1991-2020
Publications (10 Years): 2

Top Topics

Close Proximity

Magnetic Recording

Environmental Information

Top Venues

IEEE J. Solid State Circuits

Publications

Gaddi Blumrosen, Katsuyuki Sakuma, John Jeremy Rice, John U. Knickerbocker
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing. IEEE Access 8 (2020)
Katsuyuki Sakuma, Gaddi Blumrosen, John Jeremy Rice, Jeff Rogers, John U. Knickerbocker
Turning the Finger into a Writing Tool. EMBC (2019)
Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. IEEE J. Solid State Circuits 47 (4) (2012)
Paul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov
Technologies for exascale systems. IBM J. Res. Dev. 55 (5) (2011)
John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright
Three-dimensional silicon integration. IBM J. Res. Dev. 52 (6) (2008)
Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker
3D chip stacking with C4 technology. IBM J. Res. Dev. 52 (6) (2008)
John U. Knickerbocker
Preface. IBM J. Res. Dev. 52 (6) (2008)
Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker
Thermomechanical modeling of 3D electronic packages. IBM J. Res. Dev. 52 (6) (2008)
Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52 (6) (2008)
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. Solid State Circuits 41 (8) (2006)
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. CICC (2005)
John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49 (4-5) (2005)
John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth
An advanced multichip module (MCM) for high-performance UNIX servers. IBM J. Res. Dev. 46 (6) (2002)
Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. IBM J. Res. Dev. 36 (5) (1992)
John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk
IBM System/390 air-cooled alumina thermal conduction module. IBM J. Res. Dev. 35 (3) (1991)