Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.
John U. KnickerbockerChirag S. PatelPaul S. AndryCornelia K. TsangL. Paivikki BuchwalterEdmund J. SprogisHua GanRaymond R. HortonRobert J. PolastreSteven L. WrightChristian D. SchusterChristian W. BaksFuad E. DoanyJoanna RosnerSteven CordesPublished in: CICC (2005)