Hua Gan

Publication Activity (10 Years)

Years Active: 2005-2011
Publications (10 Years): 0

Publications

Hua Gan, Yufeng Jin, Min Miao, Xin Sun
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate. NEMS (2011)
Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. NEMS (2010)
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. Solid State Circuits 41 (8) (2006)
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. CICC (2005)