3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias.
John U. KnickerbockerChirag S. PatelPaul S. AndryCornelia K. TsangL. Paivikki BuchwalterEdmund J. SprogisHua GanRaymond R. HortonRobert J. PolastreSteven L. WrightJohn M. CottePublished in: IEEE J. Solid State Circuits (2006)