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3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias.

John U. KnickerbockerChirag S. PatelPaul S. AndryCornelia K. TsangL. Paivikki BuchwalterEdmund J. SprogisHua GanRaymond R. HortonRobert J. PolastreSteven L. WrightJohn M. Cotte
Published in: IEEE J. Solid State Circuits (2006)
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