Min Miao

Publication Activity (10 Years)

Years Active: 2009-2024
Publications (10 Years): 13

Top Topics

Continuous Speech Recognition

Mobile Multimedia

Machine Learning Approaches

Top Venues

Microelectron. J.

IEEE Geosci. Remote. Sens. Lett.

Publications

Yutong Wang, Min Miao, Shiliang Zhu
L-ENet: An Ultralightweight SAR Image Detection Network. IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens. 17 (2024)
Shiliang Zhu, Min Miao
SCNet: A Lightweight and Efficient Object Detection Network for Remote Sensing. IEEE Geosci. Remote. Sens. Lett. 21 (2024)
Xuena Liu, Zhensong Li, Hao Wen, Min Miao, Yuduo Wang, Zhuwei Wang
A PAM4 transceiver design scheme with threshold adaptive and tap adaptive. EURASIP J. Adv. Signal Process. 2023 (1) (2023)
Weiheng Zhao, Yudi Zhao, Min Miao
A physics-based modeling method of THz Schottky diode for circuit simulation. Microelectron. J. 136 (2023)
Min Miao, Danya Zhang, Xin Nie, Jingpeng Bu
A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging. Microelectron. J. 129 (2022)
Haitao He, Changhao Luo, Junchen Dong, Yudi Zhao, Min Miao, Kai Zhao
TSV Defects Classification with Machine Learning Approaches. ICTA (2022)
Xuena Liu, Zhensong Li, Hao Wen, Min Miao
Design of 20Gb/s PAM4 Transmitter with 2-tap FFE. CISP-BMEI (2022)
Na Li, Min Miao
Design of EMI and suppression structure based on bar-via. Microelectron. J. 112 (2021)
Zhuanzhuan Zhang, Min Miao, Xiaolong Duan
Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer. ICTA (2021)
Zhensong Li, Min Miao, Zhuwei Wang
Parallel Coding Scheme With Turbo Product Code for Mobile Multimedia Transmission in MIMO-FBMC System. IEEE Access 8 (2020)
Haoyang Li, Hong Zheng, Chuanzhao Han, Haibo Wang, Min Miao
Onboard Spectral and Spatial Cloud Detection for Hyperspectral Remote Sensing Images. Remote. Sens. 10 (1) (2018)
Xin Jin, Keliang Zhang, Xian Huang, Min Miao
On Continuous Speech Recognition of Indian English. ACAI (2018)
Xiaole Cui, Xiaoxin Cui, Yewen Ni, Min Miao, Yufeng Jin
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 25 (5) (2017)
Xin Sun, Yunhui Zhu, Zhen Hua Liu, Qing-hu Cui, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin
Electrical characterization of integrated passive devices using thin film technology for 3D integration. J. Zhejiang Univ. Sci. C 14 (4) (2013)
Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. NEMS (2013)
Yichao Xu, Guanjiang Wang, Xin Sun, Runiu Fang, Min Miao, Yufeng Jin
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. NEMS (2013)
Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin
A 3D micro-channel cooling system embedded in LTCC packaging substrate. NEMS (2012)
Hua Gan, Yufeng Jin, Min Miao, Xin Sun
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate. NEMS (2011)
Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. NEMS (2010)
Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. NEMS (2009)