A 3D micro-channel cooling system embedded in LTCC packaging substrate.

Songtao Jia Min Miao Runiu Fang Shichao Guo Duwei Hu Yufeng Jin

Published in: NEMS (2012)

Keyphrases

multi channel
high speed
high density
magnetic recording
communication channels
simulated annealing
embedded systems
real time
data sets
learning algorithm
evolutionary algorithm
neural network
image sequences
digital images
electro mechanical systems