In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.

Yichao Xu Guanjiang Wang Xin Sun Runiu Fang Min Miao Yufeng Jin

Published in: NEMS (2013)

Keyphrases

high speed
test cases
information integration
database
testing process
image processing
decision trees
digital images
design process
data fusion
line segments
statistical tests
integrated circuit
production line