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Three-dimensional silicon integration.

John U. KnickerbockerPaul S. AndryBing DangRaymond R. HortonMario J. InterranteChirag S. PatelRobert J. PolastreKatsuyuki SakumaRanjani SirdeshmukhEdmund J. SprogisSri M. Sri-JayanthaAntonio M. StephensAnna W. TopolCornelia K. TsangBucknell C. WebbSteven L. Wright
Published in: IBM J. Res. Dev. (2008)
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