High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
Rao R. TummalaJohn U. KnickerbockerSarah H. KnickerbockerL. Wynn HerronRobert W. NuferRaj N. MasterMark O. NeisserBenedikt M. KellnerCharles H. PerryJames N. HumenikThomas F. RedmondPublished in: IBM J. Res. Dev. (1992)