MULTICHIP MODULE
Experts
- Lars Brusberg
- Aramais R. Zakharian
- Christian Herbst
- Henning Schroder
- Ming Liu
- Ren-Jie Lee
- Hung-Ming Chen
- John U. Knickerbocker
- James N. Humenik
- Hai P. Longworth
- Alan F. Evans
- David Auchère
- Takeshi Yoshida
- Alex G. Dickinson
- Nathan C. Abrams
- Junying Wei
- Wenxuan Wu
- Cédric Bermond
- Fabrizio Lombardi
- Roland Frech
- Jochen Supper
- Pengcheng Yan
- Shinji Yokogawa
- Stéphane Moreau
- Hubert Harrer
- Leibo Liu
- Fangting Miao
- Charles H. Perry
- Brian A. Box
- A. Z. Muszynski
- Kevin Williams
- Junbo Wang
- Robert W. Nufer
- Klaus-Dieter Lang
- Zi-Kang Li
- Satoshi Yoshida
- Michael G. Nealon
- Makoto Nagata
- Lin Cheng
Venues
- IBM J. Res. Dev.
- IEICE Electron. Express
- Computer
- ICCD
- Hot Chips Symposium
- Microelectron. Reliab.
- OFC
- ISSCC
- IEEE Trans. Very Large Scale Integr. Syst.
- ECOC
- IEEE Micro
- 3DIC
- MBMV
- Micromachines
- RWS
- PARLE
- Trans. High Perform. Embed. Archit. Compil.
- Sensors
- WCNC Workshops
- AHFE (2)
- IRPS
- Microelectron. J.
- Bell Syst. Tech. J.
- Proc. IEEE
- IEEE J. Solid State Circuits
- IEEE Des. Test Comput.
- ICECS
- ISLPED
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- IEICE Trans. Electron.
- ICPP
- ISPD
- FCCM
- Int. J. Circuit Theory Appl.
- IEEE Trans. Circuits Syst. II Express Briefs
- PRDC
- SLIP
- COMPCON
- A-SSCC
Related Topics
Related Keywords
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