MULTICHIP MODULE
Experts
- Lars Brusberg
- Hai P. Longworth
- Henning Schroder
- Aramais R. Zakharian
- Alan F. Evans
- Hung-Ming Chen
- Christian Herbst
- James N. Humenik
- Ren-Jie Lee
- Ming Liu
- John U. Knickerbocker
- Srinivasa N. Reddy
- Junbo Wang
- Frank L. Pompeo
- Takashi Takemoto
- Kazuo Tsubouchi
- Sükrü Ekin Kocabas
- Darrell Boggs
- Peter J. Brofman
- Jürgen Koehl
- Christian Fiebig
- Yunzhi Li
- Fred J. Meyer
- Wendong Zhang
- Sergey A. Kuchinsky
- Paolo Prinetto
- Suwanna Jittinorasett
- Lihua Zhang
- Chen Li
- Kazuhiro Noguchi
- Eric Beyne
- Gang Shan
- Qi Liu
- Maurice V. Wilkes
- Tadashi Shibata
- K. D. Patil
- Xinru Jia
- Roger D. Weekly
- Biao Deng
Venues
- IBM J. Res. Dev.
- IEICE Electron. Express
- Computer
- ICCD
- IEEE Trans. Very Large Scale Integr. Syst.
- ISSCC
- Microelectron. Reliab.
- OFC
- IEEE Micro
- 3DIC
- Hot Chips Symposium
- ECOC
- FCCM
- ISLPED
- SLIP
- EURO-DAC
- RWS
- PRDC
- Micromachines
- Trans. High Perform. Embed. Archit. Compil.
- ICECS
- COMPCON
- Int. J. Circuit Theory Appl.
- ASAP
- IEEE J. Solid State Circuits
- Bell Syst. Tech. J.
- ICPP
- IEEE Des. Test Comput.
- AHFE (2)
- OECC/PSC
- IRPS
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- Sensors
- MBMV
- Proc. IEEE
- ISPD
- Adv. Comput.
- WCNC Workshops
- A-SSCC
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