MULTICHIP MODULE
Experts
- Lars Brusberg
- John U. Knickerbocker
- Aramais R. Zakharian
- Alan F. Evans
- James N. Humenik
- Ren-Jie Lee
- Hung-Ming Chen
- Henning Schroder
- Christian Herbst
- Ming Liu
- Hai P. Longworth
- Benedikt M. Kellner
- Gregory Houzet
- Philippe Artillan
- Thierry Lacrevaz
- Hongzhong Zheng
- Satoshi Yoshida
- Darrell Boggs
- Fangting Miao
- Guolong Li
- Dominic C. Bruen
- Dimin Niu
- Zhen Wang
- Wenxuan Wu
- Jianfeng Pan
- K. D. Patil
- Jian Chen
- Jinshan Zhang
- Nohpill Park
- F. Duval
- Sudipta K. Ray
- Sergey A. Kuchinsky
- Atsushi Shimada
- Subramani Sunithamani
- Lieven Eeckhout
- S. H. Kulpa
- Stéphane Moreau
- Chenyang Xue
- Donald L. Thomas
Venues
- IBM J. Res. Dev.
- ICCD
- IEICE Electron. Express
- Computer
- OFC
- ECOC
- Microelectron. Reliab.
- ISSCC
- IEEE Micro
- 3DIC
- IEEE Trans. Very Large Scale Integr. Syst.
- Hot Chips Symposium
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- Adv. Comput.
- COMPCON
- AHFE (2)
- IEEE Trans. Circuits Syst. II Express Briefs
- ICPP
- A-SSCC
- IEEE J. Solid State Circuits
- MBMV
- ISPD
- SLIP
- VLSI Design
- ISLPED
- ASAP
- Proc. IEEE
- ISCAS
- RWS
- ICECS
- OECC/PSC
- FCCM
- PRDC
- IEICE Trans. Electron.
- EURO-DAC
- Trans. High Perform. Embed. Archit. Compil.
- Sensors
- IEEE Des. Test Comput.
- WCNC Workshops
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