MULTICHIP MODULE
Experts
- Lars Brusberg
- Hung-Ming Chen
- Ming Liu
- Ren-Jie Lee
- Hai P. Longworth
- Aramais R. Zakharian
- Christian Herbst
- James N. Humenik
- Alan F. Evans
- Henning Schroder
- John U. Knickerbocker
- Deyong Chen
- M. M. Downs
- Dierk Kaller
- Lizy Kurian John
- Xinru Jia
- Alain J. Martin
- Kyoya Takano
- Otto A. Torreiter
- Shuhei Amakawa
- L. Wynn Herron
- Yulan Lu
- Anand Haridass
- Chixiao Chen
- Dongfang Pan
- Guanghua Shi
- Klaus-Dieter Lang
- Terence Collier
- Dominic C. Bruen
- Claudio Siviero
- Joerg Walter
- Raymond A. Fillion
- Rahul Agarwal
- Ao Luo
- Y. Hu
- Thomas E. Lombardi
- Mingyu Wang
- Sushumna Iruvanti
- Christopher W. Cline
Venues
- IBM J. Res. Dev.
- IEICE Electron. Express
- Computer
- ICCD
- 3DIC
- ISSCC
- ECOC
- IEEE Micro
- Hot Chips Symposium
- OFC
- IEEE Trans. Very Large Scale Integr. Syst.
- Microelectron. Reliab.
- MBMV
- ICECS
- ASAP
- WCNC Workshops
- IRPS
- IEICE Trans. Electron.
- Sensors
- ICPP
- RWS
- ISLPED
- Trans. High Perform. Embed. Archit. Compil.
- Int. J. Circuit Theory Appl.
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- COMPCON
- Adv. Comput.
- PRDC
- AHFE (2)
- A-SSCC
- OECC/PSC
- Micromachines
- EURO-DAC
- Microelectron. J.
- Proc. IEEE
- ISPD
- IEEE Trans. Circuits Syst. II Express Briefs
- VLSI Design
- IEEE Des. Test Comput.
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