MULTICHIP MODULE
Experts
- Lars Brusberg
- Alan F. Evans
- Hai P. Longworth
- Henning Schroder
- Aramais R. Zakharian
- James N. Humenik
- Hung-Ming Chen
- Christian Herbst
- John U. Knickerbocker
- Ming Liu
- Ren-Jie Lee
- Mark O. Neisser
- Minsu Choi
- Claudio Siviero
- Olalla Varela Pedreira
- Kasho Yamamoto
- Bo Jiao
- Jürgen Schietke
- Utku Soylu
- Tingting Sun
- Edward J. Yarmchuk
- Benedikt M. Kellner
- Bernard Fléchet
- Jijun Xiong
- Dominic C. Bruen
- Philip Garrou
- Raymond A. Fillion
- Mathias P. Jeanneret
- Leibo Liu
- Mingyu Wang
- David Auchère
- Kazuaki Takahashi
- Qiu-lin Tan
- Hongzhong Zheng
- William J. Roesch
- Shaojun Wei
- Chixiao Chen
- Lung-Wen Kuo
- Philippe Artillan
Venues
- IBM J. Res. Dev.
- IEICE Electron. Express
- Computer
- ICCD
- IEEE Trans. Very Large Scale Integr. Syst.
- ISSCC
- Microelectron. Reliab.
- OFC
- IEEE Micro
- 3DIC
- Hot Chips Symposium
- ECOC
- FCCM
- ISLPED
- SLIP
- EURO-DAC
- RWS
- PRDC
- Micromachines
- Trans. High Perform. Embed. Archit. Compil.
- ICECS
- COMPCON
- Int. J. Circuit Theory Appl.
- ASAP
- IEEE J. Solid State Circuits
- Bell Syst. Tech. J.
- ICPP
- IEEE Des. Test Comput.
- AHFE (2)
- OECC/PSC
- IRPS
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- Sensors
- MBMV
- Proc. IEEE
- ISPD
- Adv. Comput.
- WCNC Workshops
- A-SSCC
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