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Philippe Artillan
ORCID
Publication Activity (10 Years)
Years Active: 2007-2021
Publications (10 Years): 2
Top Topics
Emerging Technologies
Mathematical Model
Database
Multichip Module
Top Venues
3DIC
Microelectron. J.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
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Publications
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Cédric Bermond
,
Philippe Artillan
,
Michel Gay
A Microwave Frequency Range Experiment for the Measurement of Snow Density and Liquid Water Content.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
14 (2021)
Gregory Houzet
,
Thierry Lacrevaz
,
Cédric Bermond
,
Philippe Artillan
,
David Auchère
,
Laurent Schwarz
,
Bernard Fléchet
In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies.
Microelectron. J.
108 (2021)
Khadim Dieng
,
Philippe Artillan
,
Cédric Bermond
,
Olivier Guiller
,
Thierry Lacrevaz
,
Sylvain Joblot
,
Gregory Houzet
,
Alexis Farcy
,
Yann Lamy
,
Bernard Fléchet
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer.
3DIC
(2014)
Christophe Escriba
,
Remy Fulcrand
,
Philippe Artillan
,
David Jugieu
,
Aurélien Bancaud
,
Ali Boukabache
,
Anne Marie Gué
,
Jean-Yves Fourniols
Trapping Biological Species in a Lab-on-Chip Microsystem: Micro Inductor Optimization Design and SU8 Process.
VLSI-SoC (Selected Papers)
(2008)
Philippe Artillan
,
Bruno Estibals
,
Alain Salles
,
Jean Abboud
,
Pierre Aloisi
,
Corinne Alonso
A PEEC approach for circular spiral inductive components modeling.
ISCAS
(2007)