Thierry Lacrevaz

Publication Activity (10 Years)

Years Active: 2009-2021
Publications (10 Years): 1

Top Topics

Integrated Circuit

Multichip Module

Software Package

Radio Frequency

Top Venues

Microelectron. J.

Publications

Gregory Houzet, Thierry Lacrevaz, Cédric Bermond, Philippe Artillan, David Auchère, Laurent Schwarz, Bernard Fléchet
In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. Microelectron. J. 108 (2021)
Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. 3DIC (2014)
Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. 3DIC (2013)
Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Francis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. 3DIC (2009)
Julie Roullard, Stéphane Capraro, Thierry Lacrevaz, Lionel Cadix, Elie Eid, Alexis Farcy, Bernard Fléchet
Influence of 3D integration on 2D interconnections and 2D self inductors HF properties. 3DIC (2009)