Séverine Cheramy

Publication Activity (10 Years)

Years Active: 2009-2021
Publications (10 Years): 12

Top Topics

Integrated Circuit

Heterogeneous Systems

Top Venues

IEEE J. Solid State Circuits

Publications

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56 (1) (2021)
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
@ 82%-Peak-Efficiency DC-DC Converters. ISSCC (2020)
Emilie Bourjot, Paul Stewart, C. Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC (2019)
Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE (2019)
Eric Guthmuller, César Fuguet Tortolero, Pascal Vivet, Christian Bernard, Ivan Miro Panades, Jean Durupt, E. Beignc, Didier Lattard, Séverine Cheramy, Alain Greiner, Quentin L. Meunier, Pirouz Bazargan-Sabet
A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches. ESSCIRC (2018)
Pascal Vivet, Yvain Thonnart, Romain Lemaire, Cristiano Santos, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Denis Dutoit, Fabien Clermidy, Séverine Cheramy, Abbas Sheibanyrad, Frédéric Pétrot, Eric Flamand, Jean Michailos, Alexandre Arriordaz, Lee Wang, Juergen Schloeffel
A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. IEEE J. Solid State Circuits 52 (1) (2017)
Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
Towards high density 3D interconnections. 3DIC (2016)
Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC (2016)
Pascal Vivet, Yvain Thonnart, Romain Lemaire, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Cristiano Santos, Fabien Clermidy, Séverine Cheramy, Frédéric Pétrot, Eric Flamand, Jean Michailos
8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links. ISSCC (2016)
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
ITAC: A complete 3D integration test platform. 3DIC (2016)
Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
Towards high density 3D interconnections. 3DIC (2016)
Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33 (3) (2016)
Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC (2015)
Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller, Ivan Miro Panades, Gaël Pillonnet, Yvain Thonnart, Arnaud Garnier, Didier Lattard, Amandine Jouve, Franck Bana, Thierry Mourier, Séverine Cheramy
3D advanced integration technology for heterogeneous systems. 3DIC (2015)
Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC (2013)
Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. 3DIC (2013)
Y. Lamy, J.-P. Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron
Which interconnects for which 3D applications? Status and perspectives. 3DIC (2013)
Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC (2013)
G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon
3D integration demonstration of a wireless product with design partitioning. 3DIC (2011)
David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier
3D integration technology for set-top box application. 3DIC (2009)