Stéphane Moreau

Publication Activity (10 Years)

Years Active: 2002-2024
Publications (10 Years): 10

Top Topics

Mechanical Properties

Numerical Analysis

Recent Advances

Top Venues

J. Comput. Phys.

Publications

Yong Hyeon Yi, Chris H. Kim, Armen Kteyan, Alexander Volkov, Stéphane Moreau, Valeriy Sukharev
Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis. IRPS (2024)
Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD (2024)
Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. ISPD (2023)
Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS (2023)
B. Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, H. Frémont
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. IRPS (2022)
Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau
Effects of boundary conditions in fully convolutional networks for learning spatio-temporal dynamics. CoRR (2021)
Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau
Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics. ECML/PKDD (5) (2021)
J. de Laborderie, Florent Duchaine, Laurent Gicquel, Olivier Vermorel, Gaofeng Wang, Stéphane Moreau
Numerical analysis of a high-order unstructured overset grid method for compressible LES of turbomachinery. J. Comput. Phys. 363 (2018)
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS (2018)
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
ITAC: A complete 3D integration test platform. 3DIC (2016)
Pablo Salas, Luc Giraud, Yousef Saad, Stéphane Moreau
Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics. Numer. Linear Algebra Appl. 22 (6) (2015)
Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. Microelectron. Reliab. 55 (8) (2015)
Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix
direct hybrid bonding. 3DIC (2014)
Gaofeng Wang, Florent Duchaine, Dimitrios Papadogiannis, Ignacio Duran, Stéphane Moreau, Laurent Y. M. Gicquel
An overset grid method for large eddy simulation of turbomachinery stages. J. Comput. Phys. 274 (2014)
T. Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, E. Chery, F. Lorut, Lorena Anghel, Gilles Poupon
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53 (1) (2013)
Sofiane Soulimane, Arnaud Pouydebasque, Sébastien Bolis, Fabrice Jacquet, Claudine Bridoux, Florian Dupont, Christophe Poulain, Stéphane Moreau, Stephane Fanget
A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices. NEMS (2013)
Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC (2013)
Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC (2011)
Laurent Toubiana, Stéphane Moreau, Gaétan Bonnard
MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System. MIE (2005)
Stéphane Moreau, Thierry Lequeu, Robert Jérisian
Comparative study of thermal cycling and thermal shocks tests on electronic components reliability. Microelectron. Reliab. 44 (9-11) (2004)
Stéphane Moreau, Stéphane Forster, Thierry Lequeu, Robert Jérisian
Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2. Microelectron. Reliab. 42 (9-11) (2002)