Cédrick Chappaz

Publication Activity (10 Years)

Years Active: 2007-2017
Publications (10 Years): 4

Top Topics

Film Restoration

Synthetic And Real Datasets

Handheld Devices

Curvature Estimation

Top Venues

Microelectron. Reliab.

IEEE Trans. Haptics

Publications

Thomas Sednaoui, Eric Vezzoli, Brygida Maria Dzidek, Betty Lemaire-Semail, Cédrick Chappaz, Michael Adams
Friction Reduction through Ultrasonic Vibration Part 2: Experimental Evaluation of Intermittent Contact and Squeeze Film Levitation. IEEE Trans. Haptics 10 (2) (2017)
Thomas Sednaoui, Eric Vezzoli, David Gueorguiev, Michel Amberg, Cédrick Chappaz, Betty Lemaire-Semail
Psychophysical Power Optimization of Friction Modulation for Tactile Interfaces. EuroHaptics (2) (2016)
Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas
Stress management strategy to limit die curvature during silicon interposer integration. 3DIC (2015)
Thomas Sednaoui, Eric Vezzoli, Brygida Maria Dzidek, Betty Lemaire-Semail, Cédrick Chappaz, Michael Adams
Experimental evaluation of friction reduction in ultrasonic devices. World Haptics (2015)
T. Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, E. Chery, F. Lorut, Lorena Anghel, Gilles Poupon
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53 (1) (2013)
Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC (2011)
Jean-Christophe Giraudin, Franck Badets, Jean-Pierre Blanc, Emmanuel Chataigner, Cédrick Chappaz, Jorge Luis Regolini, Philippe Delpech
MIM Capacitor and BiCMOS Circuits Characterization. IEEE J. Solid State Circuits 42 (9) (2007)