Pascal Chausse

Publication Activity (10 Years)

Years Active: 2009-2015
Publications (10 Years): 0

Top Topics

Mechanical Design

Evaluation Criteria

Curvature Estimation

Top Venues

Microelectron. Reliab.

Publications

Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC (2015)
Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas
Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectron. Reliab. 55 (5) (2015)
Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas
Stress management strategy to limit die curvature during silicon interposer integration. 3DIC (2015)
Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 3DIC (2013)
David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier
3D integration technology for set-top box application. 3DIC (2009)