Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments.
Benjamin ViannePierre BarVincent FioriSebastien PetitdidierNorbert ChevrierSébastien Gallois-GarreignotAlexis FarcyPascal ChausseStephanie EscoubasNicolas HotellierOlivier ThomasPublished in: 3DIC (2013)