Sébastien Gallois-Garreignot

Publication Activity (10 Years)

Years Active: 2010-2018
Publications (10 Years): 3

Top Topics

Mechanical Design

Numerical Analysis

Stress Distribution

Top Venues

Microelectron. Reliab.

Publications

Thomas Wlanis, René Hammer, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. Microelectron. Reliab. 86 (2018)
Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas
Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectron. Reliab. 55 (5) (2015)
Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. Microelectron. Reliab. 55 (6) (2015)
Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. Microelectron. Reliab. 54 (4) (2014)
Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectron. Reliab. 53 (2) (2013)
Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 3DIC (2013)
Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC (2013)
Sébastien Gallois-Garreignot, Vincent Fiori, D. Nelias
Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. Microelectron. Reliab. 50 (1) (2010)