Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach.
Thomas WlanisRené HammerWerner EckerSandrine LhostisClément SartSébastien Gallois-GarreignotBernhard RebhanGünther A. MaierPublished in: Microelectron. Reliab. (2018)