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Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar SouareFrançois de CrecyVincent FioriM. Haykel Ben JamaaAlexis FarcySébastien Gallois-GarreignotAndras BorbelyJean-Philippe ColonnaPerceval CoudrainB. GiraudC. LavironSéverine CheramyClément TavernierJean Michailos
Published in: 3DIC (2013)
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