Jean-Philippe Colonna

Publication Activity (10 Years)

Years Active: 2011-2017
Publications (10 Years): 5

Top Topics

Integrated Circuit

Thermal Conductivity

Electromagnetic Field

Top Venues

Publications

Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI (2017)
Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC (2016)
C. Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, L. Wang
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC (2016)
Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33 (3) (2016)
Cristiano Santos, Rafael Prieto, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Reis
Graphite-based heat spreaders for hotspot mitigation in 3D ICs. 3DIC (2015)
Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC (2014)
Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis
Thermal performance of 3D ICs: Analysis and alternatives. 3DIC (2014)
Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC (2013)
G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon
3D integration demonstration of a wireless product with design partitioning. 3DIC (2011)