Login / Signup

Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.

C. SantosPascal VivetSébastien ThuriesOlivier BillointJean-Philippe ColonnaPerceval CoudrainL. Wang
Published in: 3DIC (2016)
Keyphrases
  • infrared
  • database
  • data integration
  • neural network
  • process model
  • thermal images
  • databases
  • machine learning
  • artificial neural networks
  • computational model
  • information integration