Sébastien Thuries

Publication Activity (10 Years)

Years Active: 2012-2022
Publications (10 Years): 20

Top Topics

Functional Decomposition

Integrated Circuit

Mumford Shah Functional

Recent Advances

Top Venues

Publications

Sébastien Thuries, Aida Todri-Sanial
Introduction to the Special Issue on Monolithic 3D: Technology, Design and Computing Systems Applications Perspectives. ACM J. Emerg. Technol. Comput. Syst. 18 (1) (2022)
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56 (1) (2021)
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
@ 82%-Peak-Efficiency DC-DC Converters. ISSCC (2020)
Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE (2020)
Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE (2019)
Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sébastien Thuries, Edith Beigné
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. ETS (2019)
Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. 3DIC (2019)
Pascal Vivet, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS (2018)
Dusan M. Stipanovic, Boris Murmann, Matteo Causo, Aleksandra Lekic, Vicenç Rúbies Royo, Claire J. Tomlin, Edith Beigné, Sébastien Thuries, Mykhailo Zarudniev, Suzanne Lesecq
Some Local Stability Properties of an Autonomous Long Short-Term Memory Neural Network Model. ISCAS (2018)
François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, R. Fournel, Maud Vinet
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT (2018)
David Lachartre, Francois Dehmas, Carolynn Bernier, Christophe Fourtet, Laurent Ouvry, Florent Lepin, Eric Mercier, Steve Hamard, Lionel Zirphile, Sébastien Thuries, Fabrice Chaix
7.5 A TCXO-less 100Hz-minimum-bandwidth transceiver for ultra-narrow-band sub-GHz IoT cellular networks. ISSCC (2017)
Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI (2017)
Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
Cell-on-Buffer: New design approach for high-performance and low-power monolithic 3D integrated circuits. Microelectron. J. 60 (2017)
Guillaume Berhault, Melanie Brocard, Sébastien Thuries, François Galea, Lilia Zaourar
3DIP: An iterative partitioning tool for monolithic 3D IC. 3DIC (2016)
Kaya Can Akyel, Henri-Pierre Charles, Julien Mottin, Bastien Giraud, Gregory Suraci, Sébastien Thuries, Jean-Philippe Noel
: Dynamically Reconfigurable Computing Circuit based on memory architecture. ICRC (2016)
Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet
Recent advances in 3D VLSI integration. ICICDT (2016)
C. Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, L. Wang
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC (2016)
Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint
Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. ESSDERC (2016)
Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot
Opportunities brought by sequential 3D CoolCube™ integration. ESSDERC (2016)
Gerald Cibrario, Nour Ben Salem, Joris Lacord, Karim Azizi-Mourier, Olivier Rozeau, Etienne Maurin, Olivier Billoint, Sébastien Thuries, Alexandre Valentian
From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose. 3DIC (2016)
Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. DATE (2015)
Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
An Unbalanced Area Ratio Study for High Performance Monolithic 3D Integrated Circuits. ISVLSI (2015)
Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy
Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC (2015)
Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. ISPD (2015)
Bartosz Boguslawski, Hossam Sarhan, Frédéric Heitzmann, Fabrice Seguin, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
Compact interconnect approach for networks of neural cliques using 3D technology. VLSI-SoC (2015)
Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
3DCoB: A new design approach for Monolithic 3D Integrated circuits. ASP-DAC (2014)
Romain Lemaire, Sébastien Thuries, Frédéric Heitzmann
A flexible modeling environment for a NoC-based multicore architecture. HLDVT (2012)