Claire Fenouillet-Béranger

Publication Activity (10 Years)

Years Active: 2009-2023
Publications (10 Years): 13

Top Topics

Unsupervised Learning

Data Integration

Top Venues

Publications

Claire Fenouillet-Béranger, Alexandre Bordat, Mohamed Amine Khelif, Petr Dobiás, Ngoc-Son Vu, Julien Le Kernec, David Guyard, Olivier Romain
Radar-Based Human Activity Acquisition, Classification and Recognition Towards Elderly Fall Prediction. DSD (2023)
Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, B. Sklenard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, P. Ferrari, Fred Gaillard
Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration. VLSI Technology and Circuits (2022)
Tadeu Mota Frutuoso, Jose Lugo-Alvarez, Xavier Garros, Laurent Brunet, Joris Lacord, Louis Gerrer, Mikaël Cassé, Edoardo Catapano, Claire Fenouillet-Béranger, François Andrieu, Fred Gaillard, Philippe Ferrari
Impact of spacer interface charges on performance and reliability of low temperature transistors for 3D sequential integration. IRPS (2021)
Denys R. B. Ly, Alessandro Grossi, Thilo Werner, Thomas Dalgaty, Claire Fenouillet-Béranger, Elisa Vianello, Etienne Nowak
Role of synaptic variability in spike-based neuromorphic circuits with unsupervised learning. ISCAS (2018)
François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, R. Fournel, Maud Vinet
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT (2018)
Jessy Micout, Quentin Rafhay, Xavier Garros, Mikaël Cassé, Jean Coignus, L. Pasini, Cao-Minh Vincent Lu, Nils Rambal, Claire Fenouillet-Béranger, Laurent Brunet, G. Romano, R. Gassilloud, Perrine Batude, Maud Vinet, Gérard Ghibaudo
Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices. ESSDERC (2017)
Claire Fenouillet-Béranger, S. Beaurepaire, Fabien Deprat, Alexandre Ayres De Sousa, Laurent Brunet, Perrine Batude, Olivier Rozeau, François Andrieu, Paul Besombes, M.-P. Samson, Bernard Previtali, F. Nemouchi, G. Rodriguez, Philippe Rodriguez, R. Famulok, Nils Rambal, V. Balan, Z. Saghi, V. Jousseaume, Charles-Antoine Guérin, F. Ibars, F. Proud, D. Nouguier, David Ney, V. Delaye, H. Dansas, X. Federspiel, Maud Vinet
Guidelines for intermediate back end of line (BEOL) for 3D sequential integration. ESSDERC (2017)
Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI (2017)
Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
Towards high density 3D interconnections. 3DIC (2016)
Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet
Recent advances in 3D VLSI integration. ICICDT (2016)
Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint
Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. ESSDERC (2016)
Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
Towards high density 3D interconnections. 3DIC (2016)
Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot
Opportunities brought by sequential 3D CoolCube™ integration. ESSDERC (2016)
Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. DATE (2015)
Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy
Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC (2015)
M. Azzaz, A. Benoist, Elisa Vianello, Daniele Garbin, Eric Jalaguier, Carlo Cagli, C. Charpin, Stefania Bernasconi, Simon Jeannot, T. Dewolf, G. Audoit, C. Guedj, S. Denorme, Philippe Candelier, Claire Fenouillet-Béranger, Luca Perniola
Benefit of Al2O3/HfO2 bilayer for BEOL RRAM integration through 16kb memory cut characterization. ESSDERC (2015)
Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. ISPD (2015)
Claire Fenouillet-Béranger, Bernard Previtali, Perrine Batude, F. Nemouchi, Mikaël Cassé, Xavier Garros, L. Tosti, Nils Rambal, Dominique Lafond, H. Dansas, L. Pasini, Laurent Brunet, Fabien Deprat, M. Gregoire, M. Mellier, Maud Vinet
FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration. ESSDERC (2014)
Yohann Solaro, Pascal Fonteneau, Charles-Alexandre Legrand, Claire Fenouillet-Béranger, Philippe Ferrari, Sorin Cristoloveanu
Novel back-biased UTBB lateral SCR for FDSOI ESD protections. ESSDERC (2013)
Imed Ben Akkez, Antoine Cros, Claire Fenouillet-Béranger, Frédéric Boeuf, Quentin Rafhay, Francis Balestra, Gérard Ghibaudo
New parameter extraction method based on split C-V for FDSOI MOSFETs. ESSDERC (2012)
Carlos Navarro, Noel Rodriguez, Luca Donetti, Akiko Oliata, Francisco Gámiz, François Andrieu, Olivier Faynot, Claire Fenouillet-Béranger, Sorin Cristoloveanu
Multibranch mobility characterization: Evidence of carrier mobility enhancement by back-gate biasing in FD-SOI MOSFET. ESSDERC (2012)
Olivier Thomas, Jean-Philippe Noel, Claire Fenouillet-Béranger, Marie-Anne Jaud, J. Dura, P. Perreau, Frédéric Boeuf, François Andrieu, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Andrei Vladimirescu, Amara Amara
32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit. ISCAS (2010)
Xavier Garros, Mikaël Cassé, M. Rafik, Claire Fenouillet-Béranger, Gilles Reimbold, F. Martin, Claudia Wiemer, F. Boulanger
Process dependence of BTI reliability in advanced HK MG stacks. Microelectron. Reliab. 49 (9-11) (2009)
Claire Fenouillet-Béranger, P. Perreau, S. Denorme, L. Tosti, François Andrieu, Olivier Weber, S. Barnola, C. Arvet, Y. Campidelli, Sébastien Haendler, R. Beneyton, C. Perrot, C. de Buttet, P. Gros, L. Pham-Nguyen, F. Leverd, P. Gouraud, F. Abbate, F. Baron, A. Torres, C. Laviron, L. Pinzelli, J. Vetier, C. Borowiak, A. Margain, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Olivier Faynot, Thomas Skotnicki
Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below. ESSCIRC (2009)