Didier Lattard

Publication Activity (10 Years)

Years Active: 1988-2021
Publications (10 Years): 18

Top Venues

3DIC

NEWCAS

ETS

ISSCC

Grenoble Institute of Technology, France (PHD)

Education History

Grenoble Institute of Technology, France

PHD

Publications

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56 (1) (2021)
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
@ 82%-Peak-Efficiency DC-DC Converters. ISSCC (2020)
Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE (2020)
M. Ezzadeen, D. Bosch, Bastien Giraud, S. Barraud, Jean-Philippe Noël, Didier Lattard, Joris Lacord, Jean-Michel Portal, François Andrieu
Ultra-High-density 3D vertical RRAM with stacked JunctionLess nanowires for In-Memory-Computing applications. CoRR (2020)
Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE (2019)
Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sébastien Thuries, Edith Beigné
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. ETS (2019)
Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. 3DIC (2019)
Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. 3DIC (2019)
Pascal Vivet, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS (2018)
Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné
BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. ETS (2018)
Eric Guthmuller, César Fuguet Tortolero, Pascal Vivet, Christian Bernard, Ivan Miro Panades, Jean Durupt, E. Beignc, Didier Lattard, Séverine Cheramy, Alain Greiner, Quentin L. Meunier, Pirouz Bazargan-Sabet
A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches. ESSCIRC (2018)
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS (2018)
François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, R. Fournel, Maud Vinet
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT (2018)
Imed Jani, Didier Lattard, Pascal Vivet, Edith Beigné
Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC. NEWCAS (2017)
Pascal Vivet, Yvain Thonnart, Romain Lemaire, Cristiano Santos, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Denis Dutoit, Fabien Clermidy, Séverine Cheramy, Abbas Sheibanyrad, Frédéric Pétrot, Eric Flamand, Jean Michailos, Alexandre Arriordaz, Lee Wang, Juergen Schloeffel
A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. IEEE J. Solid State Circuits 52 (1) (2017)
Pascal Vivet, Yvain Thonnart, Romain Lemaire, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Cristiano Santos, Fabien Clermidy, Séverine Cheramy, Frédéric Pétrot, Eric Flamand, Jean Michailos
8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links. ISSCC (2016)
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
ITAC: A complete 3D integration test platform. 3DIC (2016)
Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33 (3) (2016)
Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller, Ivan Miro Panades, Gaël Pillonnet, Yvain Thonnart, Arnaud Garnier, Didier Lattard, Amandine Jouve, Franck Bana, Thierry Mourier, Séverine Cheramy
3D advanced integration technology for heterogeneous systems. 3DIC (2015)
Edith Beigné, Fabien Clermidy, Didier Lattard, Ivan Miro Panades, Yvain Thonnart, Pascal Vivet
Fine-grain DVFS and AVFS techniques for complex SoC design: An overview of architectural solutions through technology nodes. ISCAS (2015)
Vincent Lenoir, Warody Lombardi, Didier Lattard, Ahmed Amine Jerraya
Design and implementation of a closed-loop controller for a self-adaptive IEEE 802.15.4 DBB. NEWCAS (2015)
Vincent Lenoir, Didier Lattard, Ahmed Amine Jerraya
An energy-efficient IEEE 802.15.4 tunable digital baseband targeting self-adaptive WPANs. ISCAS (2015)
Vincent Lenoir, Didier Lattard, Francois Dehmas, Dominique Morche, Ahmed Amine Jerraya
Computational load reduction by downsampling for energy-efficient digital baseband. NEWCAS (2014)
Vincent Lenoir, Didier Lattard, Francois Dehmas, Dominique Morche, Ahmed Amine Jerraya
Non-coherent detection of M-ary orthogonal signals using Compressive Sensing. CSNDSP (2014)
Walid Lafi, Didier Lattard, Ahmed Amine Jerraya
A Stackable LTE Chip for Cost-effective 3D Systems. IPSJ Trans. Syst. LSI Des. Methodol. 5 (2012)
Walid Lafi, Didier Lattard, Ahmed Amine Jerraya
An asynchronous hierarchical router for networks-on-chip-based three-dimensional multi-processor system-on-chip. Softw. Pract. Exp. 42 (7) (2012)
Timothé Laforest, Antoine Dupret, Arnaud Verdant, Didier Lattard, Patrick Villard
Algorithm architecture co-design for ultra low-power image sensor. Sensors, Cameras, and Systems for Industrial and Scientific Applications (2012)
Walid Lafi, Didier Lattard, Ahmed Amine Jerraya
A 3D reconfigurable platform for 4G telecom applications. DATE (2011)
Camille Jalier, Didier Lattard, Ahmed Amine Jerraya, Gilles Sassatelli, Pascal Benoit, Lionel Torres
Heterogeneous vs homogeneous MPSoC approaches for a Mobile LTE modem. DATE (2010)
Camille Jalier, Didier Lattard, Gilles Sassatelli, Pascal Benoit, Lionel Torres
Flexible and distributed real-time control on a 4G telecom MPSoC. ISCAS (2010)
Walid Lafi, Didier Lattard, Ahmed Amine Jerraya
An efficient hierarchical router for large 3D NoCs. International Symposium on Rapid System Prototyping (2010)
Camille Jalier, Didier Lattard, Gilles Sassatelli, Pascal Benoit, Lionel Torres
A Homogeneous MPSoC with Dynamic Task Mapping for Software Defined Radio. ISVLSI (2010)
Walid Lafi, Didier Lattard, Ahmed Amine Jerraya
High level modelling and performance evaluation of address mapping in NAND flash memory. ICECS (2009)
Camille Jalier, Didier Lattard, Gilles Sassatelli
A flexible modeling and simulation framework for Design Space Exploration. SoC (2008)
Didier Lattard, Edith Beigné, Fabien Clermidy, Yves Durand, Romain Lemaire, Pascal Vivet, Friedbert Berens
A Reconfigurable Baseband Platform Based on an Asynchronous Network-on-Chip. IEEE J. Solid State Circuits 43 (1) (2008)
Carolynn Bernier, Frédéric Hameau, G. Billiot, Emeric de Foucauld, S. Robinet, Didier Lattard, Jean Durupt, Francois Dehmas, Laurent Ouvry, Pierre Vincent
An Ultra Low Power SoC for 2.4GHz IEEE802.15.4 wireless communications. ESSCIRC (2008)
Didier Lattard
Trends in complex SoC Design: From technology variability to multiprocessor architectures. ICECS (2007)
Didier Lattard, Edith Beigné, Christian Bernard, Catherine Bour, Fabien Clermidy, Yves Durand, Jean Durupt, Didier Varreau, Pascal Vivet, Pierre Penard, Arnaud Bouttier, Friedbert Berens
A Telecom Baseband Circuit based on an Asynchronous Network-on-Chip. ISSCC (2007)
Julien Delorme, Dominique Houzet, Romain Lemaire, Didier Lattard
Proposition of a benchmark for evaluation of cores mapping onto NoC architectures. ReCoSoC (2005)
Romain Lemaire, Fabien Clermidy, Yves Durand, Didier Lattard, Ahmed Amine Jerraya
Performance Evaluation of a NoC-Based Design for MC-CDMA Telecommunications Using NS-2. IEEE International Workshop on Rapid System Prototyping (2005)
Dominique Noguet, Alain Merle, Didier Lattard
A Data Dependent Architecture Based on Seeded Region Growing Strategy for Advanced Morphological Operators. ISMM (1996)
Didier Lattard, Guy Mazaré
A VLSI implementation of parallel image reconstruction. CVGIP Graph. Model. Image Process. 53 (6) (1991)
Didier Lattard, Bernard Faure, Guy Mazaré
Massively parallel architecture: application to neural net emulation and image reconstruction. ASAP (1990)
Didier Lattard, Guy Mazaré
An Integrated Highly Parallel Architecture for Image Reconstruction. Advances in Computer Graphics Hardware (1988)
Didier Lattard, Guy Mazaré
An Integrated Asynchronous Cellular Array to Do Parallel Image Reconstruction. MVA (1988)

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Publication Activity (10 Years)

Top Topics

Top Venues

Didier Lattard