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Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval CoudrainPapa Momar SouareRafael PrietoVincent FioriAlexis FarcyLaurent Le-PailleurJean-Philippe ColonnaCristiano SantosPascal VivetM. Haykel Ben JamaaDenis DutoitFrançois de CrecySylvain DumasChristian ChancelDidier LattardSéverine Cheramy
Published in: IEEE Des. Test (2016)
Keyphrases
  • integrated circuit
  • experimental data
  • real world
  • image analysis
  • real time
  • machine learning
  • artificial intelligence
  • social networks
  • information systems
  • case study
  • mobile robot