Perceval Coudrain

Publication Activity (10 Years)

Years Active: 2011-2021
Publications (10 Years): 5

Top Topics

Enabling Technology

Finite Element Analysis

Top Venues

IEEE J. Emerg. Sel. Topics Circuits Syst.

Publications

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56 (1) (2021)
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
@ 82%-Peak-Efficiency DC-DC Converters. ISSCC (2020)
Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC (2016)
C. Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, L. Wang
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC (2016)
Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33 (3) (2016)
Cristiano Santos, Rafael Prieto, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Reis
Graphite-based heat spreaders for hotspot mitigation in 3D ICs. 3DIC (2015)
Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC (2014)
Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix
direct hybrid bonding. 3DIC (2014)
Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis
Thermal performance of 3D ICs: Analysis and alternatives. 3DIC (2014)
Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC (2013)
Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC (2013)
Perrine Batude, Thomas Ernst, Julien Arcamone, Gregory Arndt, Perceval Coudrain, Pierre-Emmanuel Gaillardon
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS. IEEE J. Emerg. Sel. Topics Circuits Syst. 2 (4) (2012)
G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon
3D integration demonstration of a wireless product with design partitioning. 3DIC (2011)