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Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Rafael PrietoPerceval CoudrainJean-Philippe ColonnaY. HallezChristian ChancelV. RatSylvain DumasG. RomanoR. FraniatteC. Brunet-ManquiatSéverine CheramyAlexis Farcy
Published in: 3DIC (2016)
Keyphrases
  • decision making
  • databases
  • information systems
  • multiscale
  • high speed
  • constraint satisfaction problems
  • benchmark problems
  • solution quality
  • high density
  • chemical reaction