Chip to wafer copper direct bonding electrical characterization and thermal cycling.
Yann BeilliardPerceval CoudrainLéa Di CioccioStéphane MoreauLoic SanchezBrigitte MontmayeulThomas SignamarcheixRafael EstevezGuillaume ParryPublished in: 3DIC (2013)
Keyphrases
- printed circuit boards
- integrated circuit
- electrical properties
- manufacturing process
- analog vlsi
- low cost
- high density
- high speed
- semiconductor manufacturing
- programmable logic
- electrical power
- thin film
- visual inspection
- transmission line
- neural network
- chip design
- power plant
- finite element analysis
- physical design
- visible spectrum
- distribution networks