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Loic Sanchez
Publication Activity (10 Years)
Years Active: 2011-2021
Publications (10 Years): 2
Top Topics
Programmable Logic
Chip Design
Electrical Properties
High Speed
Top Venues
OFC
3DIC
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Publications
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Claire Besancon
,
Delphine Néel
,
Joan Ramirez
,
David Bitauld
,
Giancarlo Cerulo
,
Dalila Make
,
Nicolas Vaissiere
,
Frédéric Pommereau
,
Frank Fournel
,
Loic Sanchez
,
Cécilia Dupré
,
Viviane Muffato
,
Karim Hassan
,
Jean Decobert
AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs.
OFC
(2021)
Sylvie Menezo
,
Torrey Thiessen
,
Philippe Grosse
,
Joyce K. S. Poon
,
Christophe Jany
,
Jeremy Da Fonseca
,
Bertrand Szelag
,
Benoît Charbonnier
,
Georgio El-Zammar
,
Olivier Lemonnier
,
Patricia Bilondeau
,
Stephane Malhouitre
,
Brigitte Montmayeul
,
Loic Sanchez
High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators.
OFC
(2018)
Yann Beilliard
,
Perceval Coudrain
,
Léa Di Cioccio
,
Stéphane Moreau
,
Loic Sanchez
,
Brigitte Montmayeul
,
Thomas Signamarcheix
,
Rafael Estevez
,
Guillaume Parry
Chip to wafer copper direct bonding electrical characterization and thermal cycling.
3DIC
(2013)
Perrine Batude
,
Maud Vinet
,
Arnaud Pouydebasque
,
Cyrille Le Royer
,
Bernard Previtali
,
Claude Tabone
,
Jean-Michel Hartmann
,
Loic Sanchez
,
Laurence Baud
,
Veronique Carron
,
Alain Toffoli
,
Fabienne Allain
,
Vincent Mazzocchi
,
Dominique Lafond
,
Simon Deleonibus
,
Olivier Faynot
3D monolithic integration.
ISCAS
(2011)
S. Mermoz
,
Loic Sanchez
,
Léa Di Cioccio
,
J. Berthier
,
E. Deloffre
,
C. Fretigny
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield.
3DIC
(2011)