Perrine Batude

Publication Activity (10 Years)

Years Active: 2009-2022
Publications (10 Years): 14

Top Topics

Recent Advances

Physical Design

Top Venues

Publications

Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, B. Sklenard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, P. Ferrari, Fred Gaillard
Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration. VLSI Technology and Circuits (2022)
Petros Sideris, Arnaud Peizerat, Perrine Batude, Christoforos G. Theodorou, Gilles Sicard
Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels. MOCAST (2021)
Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE (2020)
Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE (2019)
Pascal Vivet, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS (2018)
François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, R. Fournel, Maud Vinet
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT (2018)
Jessy Micout, Quentin Rafhay, Xavier Garros, Mikaël Cassé, Jean Coignus, L. Pasini, Cao-Minh Vincent Lu, Nils Rambal, Claire Fenouillet-Béranger, Laurent Brunet, G. Romano, R. Gassilloud, Perrine Batude, Maud Vinet, Gérard Ghibaudo
Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices. ESSDERC (2017)
Claire Fenouillet-Béranger, S. Beaurepaire, Fabien Deprat, Alexandre Ayres De Sousa, Laurent Brunet, Perrine Batude, Olivier Rozeau, François Andrieu, Paul Besombes, M.-P. Samson, Bernard Previtali, F. Nemouchi, G. Rodriguez, Philippe Rodriguez, R. Famulok, Nils Rambal, V. Balan, Z. Saghi, V. Jousseaume, Charles-Antoine Guérin, F. Ibars, F. Proud, D. Nouguier, David Ney, V. Delaye, H. Dansas, X. Federspiel, Maud Vinet
Guidelines for intermediate back end of line (BEOL) for 3D sequential integration. ESSDERC (2017)
Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI (2017)
Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
Towards high density 3D interconnections. 3DIC (2016)
Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet
Recent advances in 3D VLSI integration. ICICDT (2016)
Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint
Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. ESSDERC (2016)
Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
Towards high density 3D interconnections. 3DIC (2016)
Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot
Opportunities brought by sequential 3D CoolCube™ integration. ESSDERC (2016)
Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. DATE (2015)
Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy
Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC (2015)
Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. ISPD (2015)
Claire Fenouillet-Béranger, Bernard Previtali, Perrine Batude, F. Nemouchi, Mikaël Cassé, Xavier Garros, L. Tosti, Nils Rambal, Dominique Lafond, H. Dansas, L. Pasini, Laurent Brunet, Fabien Deprat, M. Gregoire, M. Mellier, Maud Vinet
FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration. ESSDERC (2014)
Ogun Turkyilmaz, Gerald Cibrario, Olivier Rozeau, Perrine Batude, Fabien Clermidy
3D FPGA using high-density interconnect Monolithic Integration. DATE (2014)
Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Giovanni De Micheli
Cell transformations and physical design techniques for 3D monolithic integrated circuits. ACM J. Emerg. Technol. Comput. Syst. 9 (3) (2013)
Joris Lacord, Perrine Batude, Gérard Ghibaudo, Frédéric Boeuf
Analytical modeling of parasitics in monolithically integrated 3D inverters. ICICDT (2012)
Perrine Batude, Thomas Ernst, Julien Arcamone, Gregory Arndt, Perceval Coudrain, Pierre-Emmanuel Gaillardon
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS. IEEE J. Emerg. Sel. Topics Circuits Syst. 2 (4) (2012)
Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot
3D monolithic integration. ISCAS (2011)
Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Thomas Ernst, Olivier Faynot, David Z. Pan, Giovanni De Micheli
CELONCEL: Effective design technique for 3-D monolithic integration targeting high performance integrated circuits. ASP-DAC (2011)
Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Vasilis F. Pavlidis, Giovanni De Micheli
Performance analysis of 3-D monolithic integrated circuits. 3DIC (2010)
Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude
System on Wafer: A New Silicon Concept in SiP. Proc. IEEE 97 (1) (2009)