Vasilis F. Pavlidis

Publication Activity (10 Years)

Years Active: 2001-2024
Publications (10 Years): 46

Top Topics

Design Methodology

Power Distribution Networks

Multicore Processors

Energy Efficiency

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

ACM Great Lakes Symposium on VLSI

Publications

Dimitrios Garyfallou, Athanasios Stefanou, Christos Giamouzis, Moschos Antoniadis, Georgios Chararas, Konstantinos Chatzis, Dimitris Samaras, Rafaela Themeli, Anastasios Michailidis, Vasiliki Gogolou, Nikos Zachos, Nestor E. Evmorfopoulos, Thomas Noulis, Vasilis F. Pavlidis, Alkiviadis Hatzopoulos, Elpida Chatzineofytou, Yiannis Moisiadis
MORCIC: Model Order Reduction Techniques for Electromagnetic Models of Integrated Circuits. CoRR (2024)
Krithika Dhananjay, Vasilis F. Pavlidis, Ayse K. Coskun, Emre Salman
Enhanced Detection of Thermal Covert Channel Attacks in Multicore Processors. ISQED (2024)
Vasiliki Gogolou, Thomas Noulis, Vasilis F. Pavlidis
CMOS Charge Pump Design for Minimal Silicon Footprint. MOCAST (2024)
Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
A New Dataflow Implementation to Improve Energy Efficiency of Monolithic 3D Systolic Arrays. CoRR (2024)
Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (12) (2023)
Georgios Chararas, Athanasios Stefanou, Alkiviadis Hatzopoulos, Vasilis F. Pavlidis
A Novel Design Methodology for Modular, Digitally Controlled, Multiband, mmWave LNAs. MOCAST (2023)
Andreas Tsiougkos, Alkis Hatzopoulos, Vasilis F. Pavlidis
Mismatch Driven Systematic Design Methodology for Transistor Based Active Resistors. MWSCAS (2023)
Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
Temperature-Aware Monolithic 3D DNN Accelerators for Biomedical Applications. CoRR (2022)
Yuanqing Cheng, Xiaochen Guo, Vasilis F. Pavlidis
Emerging monolithic 3D integration: Opportunities and challenges from the computer system perspective. Integr. 85 (2022)
Krithika Dhananjay, Vasilis F. Pavlidis, Ayse K. Coskun, Emre Salman
High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors. IEEE Trans. Very Large Scale Integr. Syst. 30 (11) (2022)
Baoli Peng, Vasilis F. Pavlidis, Yi-Chung Chen, Yuanqing Cheng
Thermal Modeling and Design Exploration for Monolithic 3D ICs. ISQED (2022)
Konstantinos Falis, Andreas Tsiougkos, Vasilis F. Pavlidis
Practical Day-Ahead Power Prediction of Solar Energy-Harvesting for IoT Systems. VLSI-SoC (2022)
Eleni Maragkoudaki, William B. Toms, Vasilis F. Pavlidis
Energy-Efficient Encoding for High-Speed Serial Interfaces. IEEE Trans. Very Large Scale Integr. Syst. 30 (10) (2022)
Minmin Jiang, Eleni Maragkoudaki, Vasilis F. Pavlidis
Mitigating EM Side-Channel Attacks with Dynamic Delay Insertion and Data Bus Inversion. ISCAS (2022)
Andreas Tsiougkos, Vasilis F. Pavlidis
A PWM-free DC-DC Boost Converter with 0.43 V Input for Extended Battery Use in IoT Applications. MWSCAS (2021)
Krithika Dhananjay, Prachi Shukla, Vasilis F. Pavlidis, Ayse K. Coskun, Emre Salman
Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects. IEEE Trans. Circuits Syst. II Express Briefs 68 (3) (2021)
Minmin Jiang, Vasilis F. Pavlidis
Performance-Aware Interconnect Delay Insertion Against EM Side-Channel Attacks. SLIP (2021)
Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116 (2021)
Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang
TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express 18 (15) (2021)
Prachi Shukla, Sean S. Nemtzow, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
Temperature-Aware Optimization of Monolithic 3D Deep Neural Network Accelerators. ASP-DAC (2021)
Minmin Jiang, Ioannis A. Papistas, Vasilis F. Pavlidis
Cost Modeling and Analysis of TSV and Contactless 3D-ICs. ACM Great Lakes Symposium on VLSI (2020)
Eleni Maragkoudaki, Vasilis F. Pavlidis
Energy-Efficient Time-Based Adaptive Encoding for Off-Chip Communication. IEEE Trans. Very Large Scale Integr. Syst. 28 (12) (2020)
Nikolaos Sketopoulos, Christos P. Sotiriou, Vasilis F. Pavlidis
Metal Stack and Partitioning Exploration for Monolithic 3D ICs. ISVLSI (2020)
Wei Wang, Vasilis F. Pavlidis, Yuanqing Cheng
Zero-skew Clock Network Synthesis for Monolithic 3D ICs with Minimum Wirelength. ACM Great Lakes Symposium on VLSI (2020)
Konstantinos Maragos, George Lentaris, Dimitrios Soudris, Vasilis F. Pavlidis
PVT-Aware Sensing and Voltage Scaling for Energy Efficient FPGAs. FPGA (2019)
Ioannis A. Papistas, Vasilis F. Pavlidis, Dimitrios Velenis
Fabrication Cost Analysis for Contactless 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs (5) (2019)
Chao Zhang, Milan Mihajlovic, Vasilis F. Pavlidis
Adaptive Transient Leakage-Aware Linearised Model for Thermal Analysis of 3-D ICs. DATE (2019)
Prachi Shukla, Ayse K. Coskun, Vasilis F. Pavlidis, Emre Salman
An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. ACM Great Lakes Symposium on VLSI (2019)
Charalampos Antoniadis, Milan Mihajlovic, Nestor E. Evmorfopoulos, Georgios I. Stamoulis, Vasilis F. Pavlidis
Efficient Linear System Solution Techniques in the Simulation of Large Dense Mutually Inductive Circuits. ICCD (2019)
Massimo Alioto, Magdy S. Abadir, Tughrul Arslan, Chirn Chye Boon, Andreas Burg, Chip-Hong Chang, Meng-Fan Chang, Yao-Wen Chang, Poki Chen, Pasquale Corsonello, Paolo Crovetti, Shiro Dosho, Rolf Drechsler, Ibrahim Abe M. Elfadel, Ruonan Han, Masanori Hashimoto, Chun-Huat Heng, Deukhyoun Heo, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Ajay Joshi, Rajiv V. Joshi, Tanay Karnik, Chulwoo Kim, Tony Tae-Hyoung Kim, Jaydeep Kulkarni, Volkan Kursun, Yoonmyung Lee, Hai Helen Li, Huawei Li, Prabhat Mishra, Baker Mohammad, Mehran Mozaffari Kermani, Makoto Nagata, Koji Nii, Partha Pratim Pande, Bipul C. Paul, Vasilis F. Pavlidis, José Pineda de Gyvez, Ioannis Savidis, Patrick Schaumont, Fabio Sebastiano, Anirban Sengupta, Mingoo Seok, Mircea R. Stan, Mark M. Tehranipoor, Aida Todri-Sanial, Marian Verhelst, Valerio Vignoli, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Jun Zhou, Mark Zwolinski, Stacey Weber
Editorial TVLSI Positioning - Continuing and Accelerating an Upward Trajectory. IEEE Trans. Very Large Scale Integr. Syst. 27 (2) (2019)
Eleni Maragkoudaki, Przemyslaw Mroszczyk, Vasilis F. Pavlidis
Adaptive Word Reordering for Low-Power Inter-Chip Communication. DATE (2019)
Przemyslaw Mroszczyk, John Goodacre, Vasilis F. Pavlidis
Energy Efficient Flash ADC With PVT Variability Compensation Through Advanced Body Biasing. IEEE Trans. Circuits Syst. II Express Briefs (11) (2019)
Przemyslaw Mroszczyk, Vasilis F. Pavlidis
Mismatch Compensation Technique for Inverter-Based CMOS Circuits. ISCAS (2018)
Przemyslaw Mroszczyk, Vasilis F. Pavlidis
Ultra-low swing CMOS transceiver for 2.5-D integrated systems. ISQED (2018)
Ioannis A. Papistas, Vasilis F. Pavlidis
Efficient Modeling of Crosstalk Noise on Power Distribution Networks for Contactless 3-D ICs. IEEE Trans. Circuits Syst. I Regul. Pap. (8) (2018)
Ioannis A. Papistas, Vasilis F. Pavlidis
Contactless Heterogeneous 3-D ICs for Smart Sensing Systems. Integr. 62 (2018)
Scott Ladenheim, Yi-Chung Chen, Milan Mihajlovic, Vasilis F. Pavlidis
The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37 (12) (2018)
Eleni Maragkoudaki, Przemyslaw Mroszczyk, Vasilis F. Pavlidis
Energy Efficiency of Low Swing Signaling for Emerging Interposer Technologies. NANOARCH (2018)
Yi-Chung Chen, Scott Ladenheim, Harry Kalargaris, Milan Mihajlovic, Vasilis F. Pavlidis
Computationally efficient standard-cell FEM-based thermal analysis. ICCAD (2017)
Ioannis A. Papistas, Vasilis F. Pavlidis
Contactless inter-tier communication for heterogeneous 3-D ICs. ISCAS (2017)
Harry Kalargaris, Vasilis F. Pavlidis
Voltage scaling for 3-D ICs: When, how, and how much? Microelectron. J. 69 (2017)
Harry Kalargaris, Yi-Chung Chen, Vasilis F. Pavlidis
STA compatible backend design flow for TSV-based 3-D ICs. ISQED (2017)
Konstantinos Maragos, George Lentaris, Dimitrios Soudris, Kostas Siozios, Vasilis F. Pavlidis
Application performance improvement by exploiting process variability on FPGA devices. DATE (2017)
Ioannis A. Papistas, Vasilis F. Pavlidis
Crosstalk noise effects of on-chip inductive links on power delivery networks. ISCAS (2016)
Scott Ladenheim, Yi-Chung Chen, Milan Mihajlovic, Vasilis F. Pavlidis
IC thermal analyzer for versatile 3-D structures using multigrid preconditioned krylov methods. ICCAD (2016)
Ioannis A. Papistas, Vasilis F. Pavlidis
Inter-Tier Crosstalk Noise On Power Delivery Networks For 3-D ICs With Inductively-Coupled Interconnects. ACM Great Lakes Symposium on VLSI (2016)
Ioannis A. Papistas, Vasilis F. Pavlidis
Bandwidth-to-area comparison of through silicon vias and inductive links for 3-D ICs. ECCTD (2015)
Paul W. Nutter, Vasilis F. Pavlidis, Jeffrey Pepper
Efficient teaching of digital design with automated assessment and feedback. EWME (2014)
Harry Kalargaris, Vasilis F. Pavlidis
Interconnect design tradeoffs for silicon and glass interposers. NEWCAS (2014)
Shashikanth Bobba, Pierre-Emmanuel Gaillardon, Ciprian Seiculescu, Vasilis F. Pavlidis, Giovanni De Micheli
3.5-D integration: A case study. ISCAS (2013)
Hu Xu, Vasilis F. Pavlidis, Xifan Tang, Wayne P. Burleson, Giovanni De Micheli
Timing Uncertainty in 3-D Clock Trees Due to Process Variations and Power Supply Noise. IEEE Trans. Very Large Scale Integr. Syst. 21 (12) (2013)
Somayyeh Rahimian, Vasilis F. Pavlidis, Xifan Tang, Giovanni De Micheli
An Enhanced Design Methodology for Resonant Clock Trees. J. Low Power Electron. 9 (2) (2013)
Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli
Effect of process variations in 3D global clock distribution networks. ACM J. Emerg. Technol. Comput. Syst. 8 (3) (2012)
Somayyeh Rahimian, Vasilis F. Pavlidis, Giovanni De Micheli
Inter-Plane Communication Methods for 3-D ICs. J. Low Power Electron. 8 (2) (2012)
Kostas Siozios, Vasilis F. Pavlidis, Dimitrios Soudris
A novel framework for exploring 3-D FPGAs with heterogeneous interconnect fabric. ACM Trans. Reconfigurable Technol. Syst. 5 (1) (2012)
Cheng Zhang, Vasilis F. Pavlidis, Giovanni De Micheli
Voltage propagation method for 3-D power grid analysis. DATE (2012)
Vasilis F. Pavlidis, Hu Xu, Giovanni De Micheli
Enhanced wafer matching heuristics for 3-D ICs. ETS (2012)
Hu Xu, Vasilis F. Pavlidis, Wayne P. Burleson, Giovanni De Micheli
The combined effect of process variations and power supply noise on clock skew and jitter. ISQED (2012)
Somayyeh Rahimian, Vasilis F. Pavlidis, Giovanni De Micheli
Design of Resonant Clock Distribution Networks for 3-D Integrated Circuits. PATMOS (2011)
Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli
Skew variability in 3-D ICs with multiple clock domains. ISCAS (2011)
Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli
Analytical heat transfer model for thermal through-silicon vias. DATE (2011)
Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman
Clock Distribution Networks in 3-D Integrated Systems. IEEE Trans. Very Large Scale Integr. Syst. 19 (12) (2011)
Ioannis Savidis, Vasilis F. Pavlidis, Eby G. Friedman
Clock distribution models of 3-D integrated systems. ISCAS (2011)
Vasilis F. Pavlidis, Hu Xu, Ioannis Tsioutsios, Giovanni De Micheli
Synchronization and power integrity issues in 3-D ICs. APCCAS (2010)
Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Vasilis F. Pavlidis, Giovanni De Micheli
Performance analysis of 3-D monolithic integrated circuits. 3DIC (2010)
Ioannis Tsioutsios, Vasilis F. Pavlidis, Giovanni De Micheli
Physical design tradeoffs in power distribution networks for 3-D ICs. ICECS (2010)
Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli
Process-induced skew variation for scaled 2-D and 3-D ICs. SLIP (2010)
Vasilis F. Pavlidis, Eby G. Friedman
Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits. Proc. IEEE 97 (1) (2009)
Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli
Repeater Insertion for Two-Terminal Nets in Three-Dimensional Integrated Circuits. NanoNet (2009)
Vasilis F. Pavlidis, Giovanni De Micheli
Power distribution paths in 3-D ICS. ACM Great Lakes Symposium on VLSI (2009)
Kostas Siozios, Vasilis F. Pavlidis, Dimitrios Soudris
A software-supported methodology for exploring interconnection architectures targeting 3-D FPGAs. DATE (2009)
Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman
Clock distribution networks for 3-D ictegrated Circuits. CICC (2008)
Vasilis F. Pavlidis, Eby G. Friedman
Physical Design Issues in 3-D Integrated Technologies. VLSI-SoC (Selected Papers) (2008)
Vasilis F. Pavlidis, Eby G. Friedman
Timing-driven via placement heuristics for three-dimensional ICs. Integr. 41 (4) (2008)
Kostas Siozios, Kostas Sotiriadis, Vasilis F. Pavlidis, Dimitrios Soudris
A software-supported methodology for designing high-performance 3D FPGA architectures. VLSI-SoC (2007)
Kostas Siozios, Kostas Sotiriadis, Vasilis F. Pavlidis, Dimitrios Soudris
Exploring Alternative 3D FPGA Architectures: Design Methodology and CAD Tool Support. FPL (2007)
Vasilis F. Pavlidis, Eby G. Friedman
3-D Topologies for Networks-on-Chip. IEEE Trans. Very Large Scale Integr. Syst. 15 (10) (2007)
Vasilis F. Pavlidis, Eby G. Friedman
3-D Topologies for Networks-on-Chip. SoCC (2006)
Vasilis F. Pavlidis, Eby G. Friedman
Via placement for minimum interconnect delay in three-dimensional (3D) circuits. ISCAS (2006)
Vasilis F. Pavlidis, Eby G. Friedman
Interconnect delay minimization through interlayer via placement in 3-D ICs. ACM Great Lakes Symposium on VLSI (2005)
Dimitrios Soudris, K. Sgouropoulos, Konstantinos Tatas, Vasilis F. Pavlidis, Adonios Thanailakis
A methodology for implementing FIR filters and CAD tool development for designing RNS-based systems. ISCAS (5) (2003)
Dimitrios Soudris, Vasilis F. Pavlidis, Adonios Thanailakis
Designing low-power energy recovery adders based on pass transistor logic. ICECS (2001)