Fengjuan Wang

Publication Activity (10 Years)

Years Active: 2007-2024
Publications (10 Years): 33

Top Topics

Analytical Models

Top Venues

IEICE Electron. Express

Microelectron. J.

IEEE Trans. Very Large Scale Integr. Syst.

Ad Hoc Networks

Publications

Meng Pang, Fengjuan Wang, Zhe Li
Credit risk prediction based on an interpretable three-way decision method: Evidence from Chinese SMEs. Appl. Soft Comput. 157 (2024)
Fengjuan Wang, Jilin Kou, Xiangkun Yin, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li
A compact fifth-order SIW BPF based on TSV technology with high selectivity. Microelectron. J. 144 (2024)
Zhaoqilin Yang, Gaoyun An, Zhenxing Zheng, Shan Cao, Fengjuan Wang
EPK-CLIP: External and Priori Knowledge CLIP for action recognition. Expert Syst. Appl. 252 (2024)
Fengjuan Wang, Ying Lu, Xiangkun Yin, Jiangfan Liu, Ningmei Yu, Yuan Yang
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectron. J. 138 (2023)
Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electron. Express 20 (10) (2023)
Fengjuan Wang, Quan Peng, Ningmei Yu, Yuan Yang
TSV-based SIW bandpass filter for W-band mobile communication applications. IEICE Electron. Express 19 (12) (2022)
Xiangkun Yin, Jingyu Lu, Fengjuan Wang
Wideband transmission optimization for heterogenous interconnection in 3D IC. IEICE Electron. Express 19 (5) (2022)
Fengjuan Wang, Kai Zhang, Xiangkun Yin, Ningmei Yu, Yuan Yang
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. IEEE Trans. Very Large Scale Integr. Syst. 30 (7) (2022)
Fengjuan Wang, Ruiqi Li, Xiangkun Yin, Ningmei Yu, Yuan Yang
Compact high-performance dual-frequency power divider based on TSV. Microelectron. J. 129 (2022)
Xiangkun Yin, Jingyu Lu, Fengjuan Wang
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. Microelectron. J. 119 (2022)
Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. IEICE Electron. Express 19 (3) (2022)
Fengjuan Wang, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang
A transformer with high coupling coefficient and small area based on TSV. Integr. 81 (2021)
Zhiyang Zhao, Baoju Zhang, Bo Zhang, Cuiping Zhang, Man Wang, Wenrui Yan, Fengjuan Wang
A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR. Ad Hoc Networks 115 (2021)
Xiangkun Yin, Fengjuan Wang
Analytical models of AC inductance and quality factor for TSV-based inductor. IEICE Electron. Express 18 (18) (2021)
Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116 (2021)
Fengjuan Wang, Baoju Zhang, Cuiping Zhang, Wenrui Yan, Zhiyang Zhao, Man Wang
Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex. Ad Hoc Networks 113 (2021)
Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang
Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. IEEE Access 9 (2021)
Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang
TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express 18 (15) (2021)
Fengjuan Wang, Jia Huang, Ningmei Yu
A high-pass filter based on through-silicon via (TSV). IEICE Electron. Express 16 (10) (2019)
Baoju Zhang, Fengjuan Wang, Gang Li, Cuiping Zhang, Chengcheng Zhang
A Multispectral Image Edge Detection Algorithm Based on Improved Canny Operator. CSPS (2019)
Xianjin Liu, Fengjuan Wang, Jiuru Yang, Xudong Zhang, Xiliang Du
Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response. Sensors 19 (16) (2019)
Baoju Zhang, Chengcheng Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang
Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection. CSPS (2019)
Fengjuan Wang, He Li, Ningmei Yu
Investigation on impact of substrate on low-pass filter based on coaxial TSV. IEICE Electron. Express 16 (2) (2019)
Baoju Zhang, Chengcheng Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang, Wenrui Yan
Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning. IEEE Access 7 (2019)
Chengcheng Zhang, Baoju Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang
A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image. EURASIP J. Wirel. Commun. Netw. 2019 (2019)
Andrew Placona, Fengjuan Wang, Rich King
Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends. AMIA (2018)
Fengjuan Wang, Jia Huang, Ningmei Yu
A novel guard method of through-silicon-via (TSV). IEICE Electron. Express 15 (11) (2018)
Fengjuan Wang, Hongjun Cao
Mode locking and quasiperiodicity in a discrete-time Chialvo neuron model. Commun. Nonlinear Sci. Numer. Simul. 56 (2018)
Fengjuan Wang, Gang Wang, Ningmei Yu
Equivalent circuit model of through-silicon-via in slow wave mode. IEICE Electron. Express 14 (22) (2017)
Andrew Placona, Fengjuan Wang, Shantanu Phatakwala, Nick Toure
Data Munging Tricks Can Build Better High Risk Maternity Predictive Models. AMIA (2017)
Fengjuan Wang, Ningmei Yu
An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 25 (3) (2017)
Fengjuan Wang, Ningmei Yu
Explicit model of thermal stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 13 (21) (2016)
Fengjuan Wang, Ningmei Yu
Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC). IEICE Electron. Express 13 (11) (2016)
Jie Jin, Hui Liu, Fengjuan Wang, Hong Peng, Jun Wang
Parallel Implementation of P Systems for Data Clustering on GPU. BIC-TA (2015)
Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express 12 (14) (2015)
Shigang Wang, Yong Yan, Fengjuan Wang, Guanxiong Wu
Based on reverse molding technology of the impeller of the fluid dynamics analysis. J. Comput. Methods Sci. Eng. 15 (2) (2015)
Fengjuan Wang, Ningmei Yu
filled coaxial-annular through-silicon via. IEICE Electron. Express 12 (22) (2015)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
Capacitance characterization of tapered through-silicon-via considering MOS effect. Microelectron. J. 45 (2) (2014)
Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electron. Express 10 (14) (2013)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
filled coaxial through-silicon-via (TSV). IEICE Electron. Express 10 (24) (2013)
Shigang Wang, Fangfang Zhou, Fengjuan Wang
Effect of Inertia Weight w on PSO-SA Algorithm. Int. J. Online Biomed. Eng. 9 (S6) (2013)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10 (20) (2013)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Ning Wang
A thermal model for the top layer of 3D integrated circuits considering through silicon vias. ASICON (2011)
Fengjuan Wang, Zhihua Xie
Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock. ICEIS (4) (2011)
Yuehu Liu, Yuanqi Su, Yang Yang, Fengjuan Wang, Maojun Yuan, Zhen Ren
A Facial Sketch Animation Generator for Mobile Communication. MVA (2007)