Xiaoxian Liu

Publication Activity (10 Years)

Years Active: 2013-2023
Publications (10 Years): 15

Top Topics

Power Consumption

Electromagnetic Fields

Top Venues

Microelectron. J.

IEEE Trans. Circuits Syst. II Express Briefs

IEICE Electron. Express

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Xiaoxian Liu, Yang Liu, Tao Zhang, Qijun Lu, Zhangming Zhu
Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband. IEEE Trans. Circuits Syst. II Express Briefs 70 (2) (2023)
Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang
A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression. Microelectron. J. 133 (2023)
Lei Wang, Xiaoxian Liu, Yunfei En, Zhangming Zhu
A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields. IEEE Trans. Circuits Syst. II Express Briefs 70 (2) (2023)
Lei Wang, Xiaoxian Liu, Chengyang Luo, Zhangming Zhu
A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components. IEEE Trans. Circuits Syst. II Express Briefs 70 (12) (2023)
Nuo Liu, Xiaoxian Liu, Chenhui Fan
Filtering SIW phase shifter based on through quartz vias technology. Microelectron. J. 136 (2023)
Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang, Zhangming Zhu
An effective method to suppress high-order modes of SIW filters with compact size. Microelectron. J. 127 (2022)
Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116 (2021)
Chenbing Qu, Zhangming Zhu, Yunfei En, Liwei Wang, Xiaoxian Liu
Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications. IEEE Trans. Very Large Scale Integr. Syst. 29 (2) (2021)
Haoyu Zhuang, He Tang, Xiaoxian Liu
Voltage Comparator With 60% Faster Speed by Using Charge Pump. IEEE Trans. Circuits Syst. (12) (2020)
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
Physics based scalable inductance model for three-dimensional solenoid inductors. Microelectron. J. 103 (2020)
Haoyu Zhuang, Xiaoxian Liu, Hao Wang
Voltage Reference With Linear-Temperature-Dependent Power Consumption. IEEE Trans. Very Large Scale Integr. Syst. 28 (4) (2020)
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Lixin Guo, Yintang Yang
Broadband inductance modeling of TXVs for 3D interconnection. Microelectron. J. 88 (2019)
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang
Electromagnetic modeling and analysis of the tapered differential through glass vias. Microelectron. J. 83 (2019)
Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. APCCAS (2018)
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Huaxi Gu, Lixin Guo
Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV). IEICE Electron. Express 15 (24) (2018)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
Capacitance characterization of tapered through-silicon-via considering MOS effect. Microelectron. J. 45 (2) (2014)
Guiting Wang, Xiaoxian Liu, Licheng Jiao, Shuang Wang
A multiscale region-based approach to automatic SAR image registration using CLPSO. IGARSS (2014)
Yintang Yang, Xiaoxian Liu, Zhangming Zhu, Ruixue Ding
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs. IEICE Electron. Express 11 (14) (2014)
Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits. IEICE Electron. Express 10 (14) (2013)
Xiaoxian Liu, Rongcai Zhao, Lin Han, Peng Liu
An Automatic Parallel-Stage Decoupled Software Pipelining Parallelization Algorithm Based on OpenMP. TrustCom/ISPA/IUCC (2013)
Xiaoxian Liu, Rongcai Zhao, Lin Han
A Compile-Time Cost Model for Automatic OpenMP Decoupled Software Pipelining Parallelization. SNPD (2013)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
filled coaxial through-silicon-via (TSV). IEICE Electron. Express 10 (24) (2013)
Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao
The impact of trapping centers on AlGaN/GaN resonant tunneling diode. IEICE Electron. Express 10 (19) (2013)
Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao
Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol 10 (2013) No 19 pp 20130588]. IEICE Electron. Express 10 (24) (2013)
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 10 (20) (2013)