Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.
Yintang YangXiaoxian LiuZhangming ZhuRuixue DingPublished in: IEICE Electron. Express (2014)
Keyphrases
- high frequency
- low frequency
- high density
- high resolution
- visual quality
- wavelet coefficients
- wavelet transform
- discrete wavelet transform
- subband
- high frequency components
- high frequencies
- integrated circuit
- low cost
- wavelet decomposition
- frequency domain
- low pass
- frequency band
- multi resolution analysis
- human visual system
- power supply
- computer vision
- image data
- image segmentation