Xiangkun Yin

Publication Activity (10 Years)

Years Active: 2015-2024
Publications (10 Years): 17

Top Topics

Analytical Models

Top Venues

Microelectron. J.

IEICE Electron. Express

Publications

Fengjuan Wang, Jilin Kou, Xiangkun Yin, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li
A compact fifth-order SIW BPF based on TSV technology with high selectivity. Microelectron. J. 144 (2024)
Fengjuan Wang, Ying Lu, Xiangkun Yin, Jiangfan Liu, Ningmei Yu, Yuan Yang
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectron. J. 138 (2023)
Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electron. Express 20 (10) (2023)
Xiangkun Yin, Jingyu Lu, Fengjuan Wang
Wideband transmission optimization for heterogenous interconnection in 3D IC. IEICE Electron. Express 19 (5) (2022)
Fengjuan Wang, Kai Zhang, Xiangkun Yin, Ningmei Yu, Yuan Yang
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. IEEE Trans. Very Large Scale Integr. Syst. 30 (7) (2022)
Fengjuan Wang, Ruiqi Li, Xiangkun Yin, Ningmei Yu, Yuan Yang
Compact high-performance dual-frequency power divider based on TSV. Microelectron. J. 129 (2022)
Xiangkun Yin, Jingyu Lu, Fengjuan Wang
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. Microelectron. J. 119 (2022)
Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. IEICE Electron. Express 19 (3) (2022)
Xiangkun Yin, Yangyang Guo, Liqiang Nie, Zhiyong Cheng
When Product Search Meets Collaborative Filtering: A Hierarchical Heterogeneous Graph Neural Network Approach. CoRR (2021)
Fengjuan Wang, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang
A transformer with high coupling coefficient and small area based on TSV. Integr. 81 (2021)
Xiangkun Yin, Fengjuan Wang
Analytical models of AC inductance and quality factor for TSV-based inductor. IEICE Electron. Express 18 (18) (2021)
Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116 (2021)
Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang
Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. IEEE Access 9 (2021)
Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang
TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express 18 (15) (2021)
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
Physics based scalable inductance model for three-dimensional solenoid inductors. Microelectron. J. 103 (2020)
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang
Electromagnetic modeling and analysis of the tapered differential through glass vias. Microelectron. J. 83 (2019)
Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. APCCAS (2018)
Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express 12 (14) (2015)