filled coaxial through-silicon-via (TSV).

Fengjuan Wang Zhangming Zhu Yintang Yang Xiaoxian Liu Ruixue Ding

Published in: IEICE Electron. Express (2013)

Keyphrases

high density
high speed
low cost
liquid crystal
silicon dioxide
solar cell
transmission electron microscopy
data mining
information systems
decision making
case study
digital libraries
color images
field effect transistors
gallium arsenide