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Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).
Fengjuan Wang
Zhangming Zhu
Yintang Yang
Xiaoxian Liu
Ruixue Ding
Published in:
IEICE Electron. Express (2013)
Keyphrases
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analytical models
solder ball connect
finite element analysis
stress distribution
analytical model
infrared
low cost
high speed
high density
finite element
high temperature
silicon dioxide
simulation models
quasi static
transmission electron microscopy