Login / Signup

Explicit model of thermal stress induced by annular through-silicon-via (TSV).

Fengjuan WangNingmei Yu
Published in: IEICE Electron. Express (2016)
Keyphrases
  • probability distribution
  • formal model
  • high level
  • probabilistic model
  • computational model
  • experimental data
  • multi agent systems
  • process model
  • mathematical model
  • conceptual model
  • neural network model