A thermal model for the top layer of 3D integrated circuits considering through silicon vias.

Fengjuan Wang Zhangming Zhu Yintang Yang Ning Wang

Published in: ASICON (2011)

Keyphrases

integrated circuit
cost function
computational model
data sets
probabilistic model
theoretical analysis
experimental data
similarity measure
mathematical model
high level
parameter estimation
statistical model
formal model
high density