A novel guard method of through-silicon-via (TSV).
Fengjuan WangJia HuangNingmei YuPublished in: IEICE Electron. Express (2018)
Keyphrases
- synthetic data
- preprocessing
- classification accuracy
- main contribution
- high accuracy
- high precision
- cost function
- experimental evaluation
- fully automatic
- computational complexity
- optimization method
- similarity measure
- clustering method
- detection method
- evaluation method
- high speed
- classification method
- mathematical model
- error rate
- particle filter
- image processing
- support vector machine
- probabilistic model
- objective function
- feature extraction