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Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).
Fengjuan Wang
Ningmei Yu
Published in:
IEICE Electron. Express (2016)
Keyphrases
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integrated circuit
three dimensional
metal oxide semiconductor
management system
low cost
information systems
high speed
information management
data processing
decision support
knowledge management
electron beam
hardware description language
d objects
digital images
software engineering
x ray
pattern recognition