Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).

Fengjuan Wang Ningmei Yu

Published in: IEICE Electron. Express (2016)

Keyphrases

integrated circuit
three dimensional
metal oxide semiconductor
management system
low cost
information systems
high speed
information management
data processing
decision support
knowledge management
electron beam
hardware description language
d objects
digital images
software engineering
x ray
pattern recognition