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Cost Modeling and Analysis of TSV and Contactless 3D-ICs.

Minmin JiangIoannis A. PapistasVasilis F. Pavlidis
Published in: ACM Great Lakes Symposium on VLSI (2020)
Keyphrases
  • real world
  • image analysis
  • computer vision
  • total cost
  • information retrieval
  • genetic algorithm
  • database systems
  • feature extraction
  • data analysis
  • communication cost
  • expected cost