Ioannis A. Papistas

ORCID

Publication Activity (10 Years)

Years Active: 2015-2023
Publications (10 Years): 15

Top Venues

ISCAS

ACM Great Lakes Symposium on VLSI

IEEE Trans. Circuits Syst. I Regul. Pap.

CoRR

University of Manchester, UK (PHD)

Education History

University of Manchester, UK

PHD

Publications

Pouya Houshmand, Giuseppe Maria Sarda, Vikram Jain, Kodai Ueyoshi, Ioannis A. Papistas, Man Shi, Qilin Zheng, Debjyoti Bhattacharjee, Arindam Mallik, Peter Debacker, Diederik Verkest, Marian Verhelst
DIANA: An End-to-End Hybrid DIgital and ANAlog Neural Network SoC for the Edge. IEEE J. Solid State Circuits 58 (1) (2023)
Nathan Laubeuf, Jonas Doevenspeck, Ioannis A. Papistas, Michele Caselli, Stefan Cosemans, Peter Vrancx, Debjyoti Bhattacharjee, Arindam Mallik, Peter Debacker, Diederik Verkest, Francky Catthoor, Rudy Lauwereins
Dynamic Quantization Range Control for Analog-in-Memory Neural Networks Acceleration. ACM Trans. Design Autom. Electr. Syst. 27 (5) (2022)
Kodai Ueyoshi, Ioannis A. Papistas, Pouya Houshmand, Giuseppe M. Sarda, Vikram Jain, Man Shi, Qilin Zheng, Juan Sebastian P. Giraldo, Peter Vrancx, Jonas Doevenspeck, Debjyoti Bhattacharjee, Stefan Cosemans, Arindam Mallik, Peter Debacker, Diederik Verkest, Marian Verhelst
DIANA: An End-to-End Energy-Efficient Digital and ANAlog Hybrid Neural Network SoC. ISSCC (2022)
Michele Caselli, Ioannis A. Papistas, Stefan Cosemans, Arindam Mallik, Peter Debacker, Diederik Verkest
Charge Sharing and Charge Injection A/D Converters for Analog In-Memory Computing. NEWCAS (2021)
Debjyoti Bhattacharjee, Nathan Laubeuf, Stefan Cosemans, Ioannis A. Papistas, Arindam Mallik, Peter Debacker, Myung Hee Na, Diederik Verkest
Design-Technology Space Exploration for Energy Efficient AiMC-Based Inference Acceleration. ISCAS (2021)
Ioannis A. Papistas, Stefan Cosemans, Bram Rooseleer, Jonas Doevenspeck, Myung Hee Na, Arindam Mallik, Peter Debacker, Diederik Verkest
in-Memory Analog Matrix-Vector-Multiplier for DNN Acceleration. CICC (2021)
Minmin Jiang, Ioannis A. Papistas, Vasilis F. Pavlidis
Cost Modeling and Analysis of TSV and Contactless 3D-ICs. ACM Great Lakes Symposium on VLSI (2020)
Ioannis A. Papistas, Vasilis F. Pavlidis, Dimitrios Velenis
Fabrication Cost Analysis for Contactless 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs (5) (2019)
Bram-Ernst Verhoef, Nathan Laubeuf, Stefan Cosemans, Peter Debacker, Ioannis A. Papistas, Arindam Mallik, Diederik Verkest
FQ-Conv: Fully Quantized Convolution for Efficient and Accurate Inference. CoRR (2019)
Ioannis A. Papistas, Vasilis F. Pavlidis
Efficient Modeling of Crosstalk Noise on Power Distribution Networks for Contactless 3-D ICs. IEEE Trans. Circuits Syst. I Regul. Pap. (8) (2018)
Ioannis A. Papistas, Vasilis F. Pavlidis
Contactless Heterogeneous 3-D ICs for Smart Sensing Systems. Integr. 62 (2018)
Ioannis A. Papistas, Vasilis F. Pavlidis
Contactless inter-tier communication for heterogeneous 3-D ICs. ISCAS (2017)
Ioannis A. Papistas, Vasilis F. Pavlidis
Crosstalk noise effects of on-chip inductive links on power delivery networks. ISCAS (2016)
Ioannis A. Papistas, Vasilis F. Pavlidis
Inter-Tier Crosstalk Noise On Power Delivery Networks For 3-D ICs With Inductively-Coupled Interconnects. ACM Great Lakes Symposium on VLSI (2016)
Ioannis A. Papistas, Vasilis F. Pavlidis
Bandwidth-to-area comparison of through silicon vias and inductive links for 3-D ICs. ECCTD (2015)

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Publication Activity (10 Years)

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Ioannis A. Papistas